Thermal Bridge Heat Transfer & Vapour Diffusion Simulation Program AnTherm Version 6.115 - 10.137

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Basics and Some Theory of AnTherm

Surface Temperatures

Once the base solutions describing a particular model have been established, temperature (boundary) conditions can be applied in the adjacent environments in order to predict a specific temperature distribution in the building component.

condensing humidity /
dew point
Here the temperature along the component surface - where condensation is most likely to occur - is of particular interest. Humidity exceeding the saturation level of an environment, i.e. the condensing humidity or dew point) [%], leads to condensation. This value is directly linked to the temperature at any given location under.
 
temperature extremes Therefore surface points at which a temperature minimum can be expected to occur must be localised in the model and explicitly evaluated with respect to specified conditions:
  •  boundary conditions - air temperatures [°C]
  •  position of coldest surface point (x, y, and z coordinates)
  •  temperature of the surface at this point [°C]
  •  associated condensing humidity (the dew point) [%]

Note: Temperature maxima, i.e. warmest surface points, are primarily of interest when assessing the factor of thermal comfort in constructions which include heat sources. For example, situations in which electrical heating could be implemented (as floor heating, or as a measure against condensation) may be evaluated comparatively to determine if the power output needed could lead to uncomfortably high surface temperatures.

Building elements which absorb and re-emanate solar gain can also be effectively approximated as heat sources and thus evaluated in order to assess constructions critically affected by solar radiation.

Condensation
Mould growth
Corrosion/Rust
Besides the avoidance of harmful water vapour condensation the mould growth or corrosion are also of importance.
The mould growth can hold at 80% RH already.
Corroding events can start even at 60% RH.

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